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Call
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SLIPS
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8th
International Workshop on
System Level Interconnect
Prediction
March 4-5, 2006
Munich, Germany
Co-sponsored by ACM SIGDA and the IEEE Computer Society
The System Level Interconnect Prediction (SLIP) Workshop focuses on the modeling and prediction of
usable properties of optimized interconnect systems and their impact on system performance. Both
theory and applications of interconnect prediction techniques are highlighted, with emphasis on
applications to architectural and micro-architectural exploration, physical design, interconnect
technology planning and communication networks. In addition to the presentation of
state-of-the-art papers in these fields, invited talks and tutorials by leading researchers aim to
encourage discussions between the architecture, physical design, and interconnect technology
communities.
Paper submission
deadline: November 18, 2005
Extended to November 25, 2005
Scope
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Interconnect prediction methodology:
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Statistical properties of complex interconnect systems
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Techniques and calibrations for "Rentian" and "non-Rentian" interconnect estimation
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A priori, on-line, or a posteriori estimation of interconnect design parameters (wire
length, area, power, delay, ...)
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Applications in system design:
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Interconnect parameter and yield estimation for use in architecture design and CAD
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Interconnect planning flows for specific objectives (e.g., low power, high performance) or
target technologies (e.g., ASIC/SoC, FPGA, System-in-package, 3-D integration,
molecular/nanoelectronics)
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Applications in technology evaluation:
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Interconnect technology prediction for long-term industry roadmap projections
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Early (predictive) evaluation of novel interconnect technologies in a system's context
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Architectural and micro-architectural effects of interconnect optimization approaches
Authors are invited to electronically submit papers of up to 8 pages in ACM proceedings format by
following the instructions at
http://www.softconf.com/start/SLIP2006.
Proposals for sessions are
also welcomed, and should be directed to the program committee. The proceedings of SLIP 2006 will
be published by ACM Press. As in previous years, we anticipate a special issue of a major journal
to be dedicated to SLIP 2006. The SLIP 2006 workshop will be co-located with and followed by
DATE'06 (Design Automation and Test in Europe -
www.date-conference.com).
Download the call for papers in pdf
format  .
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General Chair
Mike Hutton
Altera, USA
Technical Program Chair
Joni Dambre
Ghent University, Belgium
Special Sessions Chair
Amir Farrahi
Sun Microsystems, USA
Local Arrangements Chair
Jens Lienig
TU Dresden, Germany
Finance Chair
Dirk Stroobandt
Ghent University, Belgium
Publicity Chair
Ion Mandoiu
University of Connecticut, USA
Program Committee Members
Jeffrey Davis
Georgia Inst. of Tech., USA
Andrew B. Kahng
UC San Diego, USA
Andrew Kennings
University of Waterloo, Canada
Igor Markov
University of Michigan, USA
David Z. Pan
UT Austin, USA
Lou Scheffer
Cadence, USA
Dennis Sylvester
University of Michigan, USA
Payman Zarkesh-Ha
LSI Logic, USA
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