SLIP'10 Technical Program

Sunday, June 13, 2010  

Room 207AB - Anaheim Convention Center  

Breakfast 8:00am - 8:30am
  8:30am - 9:30am
Welcome Message + Keynote Speech

Shekhar Borkar, Intel Corp.  
"Future of Interconnect Fabric - A Contrarian View"

Session I: New Models and Algorithms for Multi-Core Interconnects 9:30am - 10:20am

Session Chair: Y. Cao

Modeling NoC Traffic Locality and Energy Consumption with Rent's Communication Probability Distribution
G. Bezerra, S. Forrest, M. Moses, A. Davis and P. Zarkesh-Ha

Hybrid Network on Chip (HNOC): Local Buses with a Global Mesh Architecture
P. Zarkesh-Ha, G. Bezerra, S. Forrest and M. Moses

Discussion Panel - Y. Cao, J. Wang, D. Stroobandt

Coffee Break 10:20am - 10:40am
Session II: New Modeling Design Techniques to 3D ICs 10:40am -12:05pm

Session Chair: D. Chen

Application of 3-D ICs to FPGAs (Invited Talk)
Peter Suaris, Tierlogic

Process-Induced Skew Variations for Scaled 2-D and 3-D ICs
H. Xu, V. Pavlidis and G. De Micheli

Through-Silicon-Via-aware Delay and Power Prediction Model for Buffered Interconnects in 3D ICs
D. H. Kim and S. K. Lim

Discussion Panel - J. Roy, S. Reda and D. Chen

Lunch 12:05pm - 1:10pm
Session III: New Development in Interconnect Prediction for EM, RF and Packaging 1:10pm - 3:10pm

Session Chair: C. K. Cheng

Advanced PCB Routing for Packaging (Invited Talk)
Martin DF Wong, UIUC

Simulation Based Study of Wireless RF Interconnects for Practical CMOS Implementation
A. More and B. Taskin

On-Chip EM-Sensitive Interconnect Structures
D. Li, M. Marek-Sadowska and B. Lee

Analysis of High-Performance Clock Networks with RLC and Transmission Line Effects (short)
W. Condley, X. Hu and M. Guthaus

3-2-1 Contact: An Experimental Approach to the Analysis of Contact Resistance in 45 nm and Below (short)
R. O. Topaloglu

Discussion Panel - C.-K. Cheng, T. Sato and P. Zarkesh-Ha

Coffee Break 3:10pm - 3:30pm
Panel: 10 Years Ago and 10 Years From Now 3:30pm - 4:30pm

Moderator: A. B. Kahng, UCSD

Panelists: Patrick Groeneveld, Magma, Lou Scheffer, HHMI, Dirk Stroobandt, Ghent Univ.  

Session IV: New Performance PredictionTechniques for Interconnects 4:45pm - 6:20pm

Session Chair: M. Guthaus

Performance Prediction of Throughput-Centric Pipelined Global Interconnects with Voltage Scaling
Y. Zhang, J. F. Buckwalter and C.-K. Cheng

Fast, Accurate Routing Delay Estimation
J. Qiu, S. Reda and S. Hassoun

Application of Generalized Scattering Matrix for Prediction of Power Supply Noise
K. Yamanaga, K. Masu and T. Sato

Worst-case Performance Prediction Under Supply Voltage and Temperature Variation (short)
C.-K. Cheng, A. B. Kahng, K. Samadi and A. Shayan

Discussion Panel - M. Guthaus, B. Taskin and D. Chen

Banquet Dinner at Buca Di Beppo 7:00pm - 9:00pm